2007 Meetings
!

November

!

Joint Dallas IEEE/LoneStar EDFAS meeting

Location:  Holiday Inn Select, Richardson
                   1655 N. Central Expressway, southbound service road between Arapaho and Campbell

Speaker:  Dr. Michael Pecht,  Director of CALCE:  Center for Life Cycle Engineering, University of Maryland

Topic:  China's Electronics Industry:  What are the Risks to US Companies and Consumers?

Please RSVP to m-tam2@raytheon.com by Nov. 6

Time: Technical meeting begins at 6:30pm, CST, Dinner/Social begins 6:00pm.
Please log on at least 10 minutes before the technical meeting.
Session Number: 683 529 765
Training session password: edfasieee
Teleconference: Dial: 1 866 - 427 - 0083 then enter the conferencing room number
*7948227*. Please note you must press the star key before and after entering the conferencing room number.
Please click the following link to see more information about the training session,
including its agenda, or to join the session.
https://asminternational.webex.com/asminternational/k2/j.php?ED=92992037&UID=54291887

Sept

!
Meeting sponsor: Carl Zeiss SMT Inc.
Speaker: Bill Thompson, Chief Scientist for Carl Zeiss SMT Inc.
Topic "The Helium Ion Microscope for FA Applications".

August

!
Joint meeting with the local IEEE Reliability Society. 
Speaker:  Dr. Craig Hillman, CEO and Managing Partner for DfR Solutions.
Topic:  “Understanding Failure and Root-Cause Analysis in Pb-Free Electronics”.
Description:
Increasing needs for performance, low cost, and a constant turnover in the electronics industry makes improving functionality a constant topic of interest. However, restrictions on machine performance (is your computer much better than the one 2 years ago?) and cost (how many more companies can move to China?) have made quality/reliability a critical differentiator in today’s crowded marketplace. This has become especially true during the transition to Pb-free and ‘green’ electronics, as those companies who fail to respond promptly to field/warranty issues can be expected to be left behind.

How to ensure optimum quality/reliability of your Pb-free product? It all starts with root-cause analysis, which is the fundamental exercise in understanding how electronic products can and will fail.
This course will provide an in-depth understanding of the failure mechanisms that are unique to Pb-free electronics and provides a comprehensive review of the tools and techniques to identify those mechanisms. Mechanisms are addressed based upon the packaging level in which they are affiliated, including component packaging, discrete components, printed circuit board, and interconnects. A physics of failure (PoF) based approach to the mechanisms are taken, with an outline of drivers of these mechanisms, including defect-driven, overstress, and wearout, and how an understanding of these stress-strength interactions can provide guidance on the appropriate corrective and preventative action. A wide variety of case studies, including red phosphorus in epoxy encapsulants, creepage corrosion in immersion silver, and solder joint failures, are provided as valuable teaching examples.

Dr. Hillman's presentation is available by contacting him at askdfr@dfrsolutions.com

May

!

Wed. May 23, @ 6:00 pm at the Holiday Inn Express, 700 Central Parkway East, Plano TX 75074.  The meeting room will be the Collin Creek Conference room.
Speaker:  Ms. Efrat Raz, Gatan
Presentation @ 6:30pm: 
Computer Controlled Sample Preparation Platform for Automated PARALLEL, X-sectioning, Thinning and Shallow Bevel Polishing to Support Failure Analysis of the Latest Semiconductor Devices (Front-end and Backend).  This presentation will discuss the latest computer controlled polishing systems.  The capabilities will be demonstrated with customers' results images from high resolution optical microscopy, as well as electron microscopy, SEM, TEM/STEM, SCM, SRM, SIMS, etc.

We will begin with a 30 minute social with food and drinks provided by Gatan, our meeting sponsor

April

!
Wednesday April 25th, at the Holiday Inn Express , 700 Central Parkway East, Plano TX 75074.

Here is the link to their site. http://www.ichotelsgroup.com/h/d/ex/1/en/hotel/DALPN?&.

The meeting will be in the Collin Creek Conference room. We will start the meeting at 6:00 pm with a 30 to 45 minutes of social time for food and discussion. We will have the speaker begin around 6:45 pm.  This will be a joint meeting of the EDFAS Lone Star Chapter and the North Texas ASM Chapter.

Speaker:  Dr. Larry Wagner, past president of EDFAS and the current president of ASM.

Topic: "Materials Analysis in Electronic Devices"

(Click the above link to download presentation)

Abstract:  Chemical analysis can play a key role in the understanding the root cause of electronic device failures. The identification of the chemical makeup of particles and contaminants plays a vital role in understanding the sources of these contaminants. This session will provide a basic understanding of the physical principles and examples of applications of the analysis techniques most commonly used in the failure analysis of electronic devices.

The most commonly used technique is Energy Dispersive Analysis which had many advantages for failure analysis. Other techniques such as Auger and X-ray Photoelectron Spectroscopy provide better surface analysis. SIMS is commonly used to provide better sensitivity while techniques like Raman and FTIR provide better identification of organic materials. Other complementary techniques will also be discussed.

Sponsor: Hitachi High Technology

March

!

BBQ was provided by our meeting sponsor - David Leland from Thermo Fisher Scientific (NORAN)

March 29, Thursday, @ 6:30 pm at the University of North Texas (UNT) College of Engineering Materials Science Center. The meeting was held in the B.155 auditorium.

Speaker: Dr. Brian Gorman from UNT
Topic:  "Atomic Level Characterization of Semiconductor Devices Using Atom Probe Tomography".

Jan

!

Microtech Analytical Labs, Plano, Tx, on Wed. Jan 24.

Sponsor:  Rhett Johnson and Peter Carlson of FEI Company

Our Speaker was Dr. Bruce Gnade of the University of Texas at Dallas Nanotechnology group.

Most folks use the nanoprober to measure I-V characteristics of circuits but Dr. Gnade spoke on the use of a nanoprobe inside an SEM to measure the work function of individual grains of metal on gate dielectric using C-V measurements for metal gate applications.

Dr. Gnade's presentation:  click here